Article ID: 000083769 Content Type: Troubleshooting Last Reviewed: 04/18/2023

Why is the package temperature higher than the die temperature on Intel® FPGA Programmable Acceleration Card N3000?

Environment

  • Intel® Quartus® Prime Pro Edition
  • Intel® Acceleration Stack for Intel® FPGA PAC N3000 - Runtime IAS-N3000-Runtime
  • BUILT IN - ARTICLE INTRO SECOND COMPONENT
    Description

    When reading temperature by fpgainfo temp command on Intel® FPGA Programmable Acceleration Card N3000, the package temperature may be higher than the die temperature.
    It's expected behavior.

     

     

    Resolution

    The package temperature and die temperature are both temperatures of the Intel® Arria® 10 FPGA.

    The die temperature is the temperature value read by the on-board sensor component via the TEMPDIODE pins of Intel® Arria® 10 FPGA.
    The accuracy is +/-1C.

    The package temperature is the temperature value read by the internal TSD (Temperature Sensing Diode) of Intel® Arria® 10 FPGA.
    The accuracy is +/- 5C.

    Related Products

    This article applies to 2 products

    Intel® FPGA PAC N3000
    Intel® Arria® 10 GT FPGA